Manuscript submission

Manuscript submission

The deadline for submission of all manuscripts (including late news and invited/plenary manuscripts) is September 12th, 2016.

The proceedings of ECSCRM 2016 will be published by Trans Tech Publications Inc. (TTP) in Materials Science Forum (http://www.scientific.net/MSF)

The authors of accepted ECSCRM 2016 papers are requested to submit their manuscripts using the TTP manuscript submission system. This system will be used to process your manuscript electronically from initial submission through editorial peer review and revisions to final publication.

The e-mails with unique user ID, password and instruction needed to log in the TTP manuscript submission system have been sent to all corresponding authors of accepted abstracts.

Note, that some e-mail clients may identify this e-mail as {spam} and automatically delete or filter it. Please, check your “deleted/junk/spam  email” folder for e-mail sent by Silicon Carbide and Related Materials… 9783035710434@scientific.net  and then contact the ECSCRM 2016 through the conference website (https://ecscrm2016.org/contact/) if the problem is still not resolved.

Manuscript preparation

Manuscripts must adhere to the following length restrictions: contributed papers (both oral presentations and posters) maximum of 4 pages, invited papers (both oral presentations and posters) maximum of 6 pages.

Please provide keywords. Do not use PACS numbers or general keywords such as “silicon carbide” or “gallium nitride”. Keywords are used to prepare the index. You should choose keywords that will be likely to lead interested readers to your paper.

Proceedings format

The manuscript templates with detailed instructions can be downloaded from the Conference website and are also available in the TTP manuscript submission system.

Download the manuscript template with detailed instruction:

Copyright transfer agreement

The online form to fill the copyright transfer agreement is available in the TTP manuscript submission system. It can be downloaded from the Conference website also:

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